1. 2. 3. material content data sheet sales product name ipd031n06l3 g issued 29. august 2013 ma# MA000505426 package pg-to252-3-11 weight* 373.28 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.184 1.39 1.39 13888 13888 leadframe non noble metal iron 7439-89-6 0.234 0.06 628 inorganic material phosphorus 7723-14-0 0.070 0.02 188 non noble metal copper 7440-50-8 234.187 62.74 62.82 627373 628189 wire non noble metal aluminium 7429-90-5 10.000 2.68 2.68 26790 26790 encapsulation organic material carbon black 1333-86-4 1.158 0.31 3102 plastics epoxy resin - 20.265 5.43 54289 inorganic material silicondioxide 60676-86-0 94.376 25.28 31.02 252830 310221 leadfinish non noble metal tin 7440-31-5 3.740 1.00 1.00 10019 10019 plating non noble metal nickel 7440-02-0 0.091 0.02 243 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 244 solder noble metal silver 7440-22-4 0.099 0.03 266 non noble metal tin 7440-31-5 0.080 0.02 213 non noble metal lead 7439-92-1 3.796 1.02 1.07 10170 10649 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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